High frequency composite wafer thickness measuring probe

The high-frequency thickness probe of Jiangyin Aidi Ultrasound Technology Co., Ltd. uses the unique piezoelectric composite wafer and high-efficiency acoustic coupling material of Aidi Ultrasound. The probe performance has high resolution, high penetration, and high signal-to-noise ratio. The advantages of noise, etc., the sensitivity is more than 10dB higher than that of ordinary piezoelectric ceramic probes, and more than 20dB higher than piezoelectric film probes.

Specifications and parameters of high frequency composite wafer thickness probe

frequency

(MHz)

Wafer diameter

(mm)

Delay line diameter

(mm)

Shell diameter(mm)

Total length of shell(mm)

Cable Connector

Delay line thickness (optional)

15

3.0

4.5

10.0

22

L5

5-8 mm

15

4.0

4.5

10.0

22

L5

5-8 mm

15

5.0

5.5

10.0

22

L5

5-8 mm

20

3.0

4.5

10.0

22

L5

5-8 mm

20

4.0

4.5

10.0

22

L5

5-8 mm

25

2.0

Will be launched soon

10.0

22

L5

5-8 mm

25

3.0

Will be launched soon

10.0

22

L5

5-8 mm


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